AI

Graphcore Goes Full 3D With AI Chips

The 3D stacking of chips has been the subject of much speculation and innovation in the past decade, and we will be the first to admit that we have been mostly thinking about this as a way to cram more capacity into a given compute engine while at the same time getting components closer together along the Z axis and not just working in 2D anymore down on the X and Y axes.

Compute

The Money Printing Press That Is Chip Maker TSMC

Not every manufacturing node comes out perfectly and not every one comes out on time, but in the past decade and a half, Taiwan Semiconductor Manufacturing Co, the world’s largest and most technologically advanced etcher of chips in the world, has done far better than any of its few remaining peers to push the chip manufacturing envelope while also maintaining consistent and profitable production of older nodes.

Compute

The Chip Has Hit The Fan

If you are a designer of chips  based on the most advanced processes available from Taiwan Semiconductor Manufacturing Company, and your roadmap is based on the company’s continuing progress and prowess in pushing Moore’s Law to the limit, then not only is the future in your roadmaps being pushed out, but you are going to have to pay more for whatever chips you are making now and, we suspect, the chips you are depending on for your business in the future.